The Prototype Packaging and Photolithography Lab focus on prototype fabrication for photonics , electronics, and MEMS. There is a probe station, die bonder, wedge and ball bonder for prototype packaging. There is also equipment for alignment and assembly required to integrate fibers, wave-guides and micro-optic components onto a common miniaturized substrate. These kinds of assemblies are required by the telecommunications industry but will find numerous applications in the industrial and medical industries.
The dark room is located in the cleanroom and has photolithography capabilities which include a spin coater, mask aligner, UV exposure, and plasma cleaner. Our critical point dryer allows for release of MEMS structures.
The laser marking and machining suite consists of a 15 Watt Nd:Yag, 4 Watt tripled Yag, 60 Watt CO2, along with a laser marking head.
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